Connectivity platform for mobile electronics products now available in wafer-level CSP
significantly reduces board space requirements for mobile applications
60% reduction in footprint compared to smallest BGA package
May 28, 2008 --- QuickLogic's innovative connectivity platform targeting the handheld electronics product market, ArcticLink, is now available in compact wafer level chip scale packaging (WLCSP).
ArcticLink reduces design time and risk for mobile product developers by embedding hard-wired host controllers with a programmable fabric - all in a single, low power device. The new 4.42 x 5.74 mm WLCSP version of this device saves considerable PCB space compared with conventional BGA packaging, helping developers to pack more features into smaller form factors.
"As mobile devices grow in complexity, designers are hard pressed to pack additional functionality and intelligence into smaller footprints," said QuickLogic's senior solutions marketing manager, Howard Li. "By delivering our ArcticLink CSSP platform in WLCSP form, we allow handset OEMs and ODMs to address all their connectivity needs in the smallest possible area."
ArcticLink is part of QuickLogic's Customer Specific Standard Product (CSSP) offering. It combines hard-wired building blocks such as Hi-Speed USB 2.0 On-The-Go, SD, SDIO, MMC and CE-ATA, with an ultra-low power programmable fabric for implementing custom functions.
QuickLogic customises the fabric, usually in a matter of days or weeks. Fabricating the CSSP then requires only electrical programming of a stock wafer.
WLCSP eliminates the area overhead of conventional BGA packaging. It is achieved with a standard die by fabricating an additional metal redistribution layer to re-route the I/O lines from the perimeter bonding pads to an array. It then 'bumps' (adds solder balls to) the array, making it ready for customers to use in conventional surface-mount fabrication processes.
About QuickLogic:
QuickLogic Corporation (NASDAQ: QUIK) is the inventor and pioneer of innovative, customisable semiconductor solutions for mobile and portable electronics OEMs and ODMs. These silicon plus software solutions are called Customer Specific Standard Products (CSSPs). CSSPs enable customers to bring their products to market more quickly and remain in the market longer, with the low power, cost and size demanded by the mobile and portable electronics market. For more information about QuickLogic and CSSPs, visit http://www.quicklogic.com.
QuickLogic, 15 London Street, Chertsey KT16 8AP, UK.
t: +44-1932-579011; ; http://www.quicklogic.com
QuickLogic, pASIC, PolarPro, the PolarPro design, QuickPCI, QuickRAM, QuickWorks and ViaLink are registered trademarks, and ArcticLink, the QuickLogic logo and VEE are trademarks of QuickLogic. Other trademarks are the property of their respective companies.
